Web Hosting & Remote IT Support South Korean memory giant SK Hynix, which recently announced plans for the construction of the world's largest chip factory , has now announced a major partnership with top Taiwanese semiconductor foundry, TSMC. The two firms aim to cement their positions in the fast-growing AI market by developing and producing the next-generation of High Bandwidth Memory, known as HBM4. The production, scheduled for 2026, will make use of TSMC’s state-of-the-art packaging technology. The project's initial focus will be on the improvement of the performance of the base die, the element of HBM that connects directly to the GPU. SK Hynix will reportedly adopt TSMC’s advanced logic process for HBM4’s base die, allowing for extra functionality to be packed into a minimal space. The two firms intend to optimize the integration SK Hynix’s HBM and TSMC’s CoWoS (Chip on Wafer on Substrate) technology. A strategic move for TSMC “We expect a strong partnership
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